[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints
Fahim, Abdullah, Ahmed, Sudan, Suhling, Jeffrey C., Lall, PradeepYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00355
File:
PDF, 51 KB
english, 2018