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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Deep Understanding the role of Cu in RDL to Warpage by Exploring the Warpage Evolution with Microstructural Changes
Cheng, Gong, Xu, Gaowei, Gai, Wei, Luo, LeYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00364
File:
PDF, 2.56 MB
english, 2018