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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Enhancements on Underfill Materials' Thermal Conductivity by Insulation Coating Layer Control of Conductive Particles
Kim, Tae-Ryong, Joo, Kisu, Lim, Boo Taek, Choi, Sung-Soon, Lee, Boung Ju, Yoon, Euijoon, Jeong, Se Young, Yim, Myung JinYear:
2018
Language:
english
DOI:
10.1109/ECTC.2018.00366
File:
PDF, 620 KB
english, 2018