[IEEE 2018 IEEE International Interconnect Technology Conference (IITC) - Santa Clara, CA, USA (2018.6.4-2018.6.7)] 2018 IEEE International Interconnect Technology Conference (IITC) - Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
Briggs, Benjamin D., Pcethala, C. B., Rath, D. L., Lee, J., Nguyen, S., LiCausi, N. V., McLaughlin, P. S., You, H., Sil, D., Lanzillo, N. A., Huang, H., Patlolla, R., Haigh, T., Xu, Y., Park, C., KerbYear:
2018
Language:
english
DOI:
10.1109/IITC.2018.8430476
File:
PDF, 1.40 MB
english, 2018