![](/img/cover-not-exists.png)
Corrigendum to “On the increase of intermetallic compound’s thickness at the cold side in liquid Sn and SnAg solders under thermal gradient” [Mater. Lett. 172 (2016) 211–215]
Kunwar, Anil, Ma, Haoran, Ma, Haitao, Sun, Junhao, Zhao, Ning, Huang, MingliangVolume:
230
Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2018.07.013
Date:
November, 2018
File:
PDF, 210 KB
english, 2018