A low temperature die attach technique for high temperature applications based on indium infiltrating micro-porous Ag sheet
Xie, Xingchi, Hang, Chunjin, Wang, Jianqiang, Su, Yue, Ma, Jie, Guo, Qiang, Chen, Hongtao, Li, MingyuLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-9944-9
Date:
August, 2018
File:
PDF, 3.10 MB
english, 2018