Thermal analysis of microwave GaN-HEMTs in conventional and flip-chip assemblies
Feghhi, Rouhollah, Joodaki, MojtabaLanguage:
english
Journal:
International Journal of RF and Microwave Computer-Aided Engineering
DOI:
10.1002/mmce.21513
Date:
August, 2018
File:
PDF, 2.82 MB
english, 2018