![](/img/cover-not-exists.png)
[IEEE 2018 IEEE International Interconnect Technology Conference (IITC) - Santa Clara, CA, USA (2018.6.4-2018.6.7)] 2018 IEEE International Interconnect Technology Conference (IITC) - Silicide Based Low Temperature and Low Pressure Bonding of TI/SI for Microfludic and Hermetic Selaling Application
Kumar, C Hemanth, Pnaigrahi, Asisa Kumar, Paul, Nirupam, Bonam, Satish, Krishna Vanjari, Siva Rama, Singh, Shiv Govind, Panigrahi, Asisa KumarYear:
2018
Language:
english
DOI:
10.1109/IITC.2018.8430450
File:
PDF, 2.14 MB
english, 2018