Scalable, Modular Three-Dimensional Silicon Microelectrode Assembly via Electroless Plating
Scholvin, Jörg, Zorzos, Anthony, Kinney, Justin, Bernstein, Jacob, Moore-Kochlacs, Caroline, Kopell, Nancy, Fonstad, Clifton, Boyden, EdwardVolume:
9
Language:
english
Journal:
Micromachines
DOI:
10.3390/mi9090436
Date:
August, 2018
File:
PDF, 3.71 MB
english, 2018