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[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Investigations of temperature resistance of memory BGA components during multi-reflow processes for Circular Economy applications
Sitek, Janusz, Koscielski, Marek, Dawidowicz, Piotr, Ciszewski, Piotr, Khramova, Mariia, Quang, Duc Nguyen, Martinez, SergioYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346853
File:
PDF, 1021 KB
english, 2017