Failure and failure characterization of QFP package...

Microelectronics Reliability 2018 / 12 Vol. 91

Failure and failure characterization of QFP package interconnect structure under random vibration condition

Jiaxing, Hu, Bo, Jing, Zengjin, Sheng, Fang, Lu, Yaojun, Chen, Yulin, Zhang
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Volume:
91
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.08.011
Date:
December, 2018
File:
PDF, 3.03 MB
english, 2018
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