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Thermal strain analysis of composite materials by electronic speckle pattern interferometry
Koung Suk Kim, Wan Shik Jang, Myung Seak Hong, Ki Soo Kang, Hyun Chul Jung, Young Jun Kang, Sung Pil YangVolume:
14
Language:
english
Pages:
6
DOI:
10.1007/bf03185649
Date:
May, 2000
File:
PDF, 742 KB
english, 2000