Microstructure and Thermal Conductivity of Sintered...

Microstructure and Thermal Conductivity of Sintered Reaction-Bonded Silicon Nitride: The Particle Size Effects of MgO Additive

Go, Shin-Il, Li, Yinsheng, Ko, Jae-Woong, Kim, Ha-Neul, Kwon, Se-Hun, Kim, Hai-Doo, Park, Young-Jo
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Volume:
2018
Language:
english
Journal:
Advances in Materials Science and Engineering
DOI:
10.1155/2018/4263497
Date:
September, 2018
File:
PDF, 3.09 MB
english, 2018
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