[IEEE 2018 IEEE/MTT-S International Microwave Symposium - IMS 2018 - Philadelphia, PA, USA (2018.6.10-2018.6.15)] 2018 IEEE/MTT-S International Microwave Symposium - IMS - An Echo-Canceller-Iess NFIC- TSV Hybrid 3D Interconnect for Simultaneous Bidirectional Vertical Communication

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