Electrothermal coupling analysis and experimental...

Electrothermal coupling analysis and experimental verification for wirebond devices

Kao, Chin-Li, Chen, Tei-Chen
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Volume:
42
Journal:
Transactions of the Canadian Society for Mechanical Engineering
DOI:
10.1139/tcsme-2017-0013
Date:
September, 2018
File:
PDF, 4.27 MB
2018
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