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Effect of ultrasonic vibration on the interfacial IMC three-dimensional morphology and mechanical properties of Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu halogen free solder joints
Zhao, Di, Zhang, Keke, Cui, Jianguo, Ma, Ning, Pan, Yibo, Yin, ChenxiangLanguage:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-0008-y
Date:
September, 2018
File:
PDF, 2.96 MB
english, 2018