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[IEEE 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Oulu (2018.6.12-2018.6.14)] 2018 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) - Wafer-level Re-Packaging of Commercial Components for Miniaturization and Embedding
Muller, Jens, Hulsmann, Markus, Gutzeit, Nam, Fischer, MichaelYear:
2018
Language:
english
DOI:
10.23919/NORDPAC.2018.8423859
File:
PDF, 525 KB
english, 2018