Study on the Subsurface Microcrack Damage Depth in...

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Ceramics International 2018 / 9

Study on the Subsurface Microcrack Damage Depth in Electroplated Diamond Wire Saw Slicing SiC Crystal

Gao, Yufei, Chen, Yang, Ge, Peiqi, Zhang, Lei, Bi, Wenbo
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Language:
english
Journal:
Ceramics International
DOI:
10.1016/j.ceramint.2018.09.088
Date:
September, 2018
File:
PDF, 1.39 MB
english, 2018
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