Thermal conductivity and adhesion properties of thermally...

Thermal conductivity and adhesion properties of thermally conductive pressure-sensitive adhesives

Jin Kon Kim, Jong Won Kim, Myung Im Kim, Min Seok Song
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Volume:
14
Language:
english
Pages:
7
DOI:
10.1007/bf03218718
Date:
October, 2006
File:
PDF, 1.49 MB
english, 2006
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