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AIP Conference Proceedings [Author(s) 3RD ELECTRONIC AND GREEN MATERIALS INTERNATIONAL CONFERENCE 2017 (EGM 2017) - Krabi, Thailand (29–30 April 2017)] - A crunch on thermocompression flip chip bonding
Suppiah, Sarveshvaran, Ong, Nestor Rubio, Sauli, Zaliman, Sarukunaselan, Karunavani, Alcain, Jesselyn Barro, Mahmed, Norsuria, Retnasamy, VithyacharanVolume:
1885
Year:
2017
Language:
english
DOI:
10.1063/1.5002459
File:
PDF, 643 KB
english, 2017