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Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging
Xiong, Ming-yue, Zhang, LiangLanguage:
english
Journal:
Journal of Materials Science
DOI:
10.1007/s10853-018-2907-y
Date:
September, 2018
File:
PDF, 4.37 MB
english, 2018