The Increasing Role of Polymers in Advanced Packaging - From Stress Buffer Layers to Wafer Level Underfills and Beyond
Miller, Andy, Rebibis, Kenneth J., Duval, Fabrice D. D., Wang, Teng, Slabbekoorn, John, De Vos, Joeri, Beyne, EricVolume:
30
Year:
2017
Language:
english
Journal:
Journal of Photopolymer Science and Technology
DOI:
10.2494/photopolymer.30.17
File:
PDF, 4.26 MB
english, 2017