Etch characteristics of copper thin films in high density...

Thin Solid Films 2018 / 11 Vol. 665

Etch characteristics of copper thin films in high density plasma of CH4/O2/Ar gas mixture

Lim, Eun Taek, Ryu, Jin Su, Chung, Chee Won
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Volume:
665
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2018.08.046
Date:
November, 2018
File:
PDF, 1.68 MB
english, 2018
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