An Improved SPICE Model of SiC BJT Incorporating Surface Recombination Effect
Wang, Jun, Liang, Shiwei, Deng, Linfeng, Yin, Xin, Shen GAE, JohnYear:
2018
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/TPEL.2018.2871594
File:
PDF, 980 KB
english, 2018