[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Research on Failure Mechanism of Chip Welding Voids for Power Semiconductor Devices
Wang, Youliang, Peng, Zeya, He, Shengzong, Zhu, Binruo, Zhang, Yin, Chen, JintaoYear:
2018
Language:
english
DOI:
10.1109/IPFA.2018.8452578
File:
PDF, 749 KB
english, 2018