Multilayered Sn/Ag3Sn Electroplating on Cu Alloys for High...

Transactions of The Japan Institute of Electronics Packaging 2014 Vol. 7; Iss. 1

Multilayered Sn/Ag3Sn Electroplating on Cu Alloys for High Reliable Electronic/Electric Materials

Kure-Chu, Song-Zhu, Ogasawara, Tohru, Yashiro, Hitoshi, Ye, Rongbin, Hosokai, Takuya, Uchidate, Michimasa, Suziki, Eiichi, Naito, Tomoyuki
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Volume:
7
Year:
2014
Language:
english
Journal:
Transactions of The Japan Institute of Electronics Packaging
DOI:
10.5104/jiepeng.7.79
File:
PDF, 2.73 MB
english, 2014
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