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[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Soft Defect Localization of Hot Failure by Dynamic Analysis by Laser Stimulation using Hamamatsu iPhemos
P. Llamcra, paul Hubert, G. Garcia-Awitan, Camille Joyce, P. Domantay, Kathlyn KayeYear:
2018
Language:
english
DOI:
10.1109/IPFA.2018.8452502
File:
PDF, 898 KB
english, 2018