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[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Enhancement of FIB Fault Isolation Analysis using Plasma Cleaning
Yeoh, Lai-Seng, Ong, Huey-Lin, Chong, Kok-Cheng, Li, SusanYear:
2018
Language:
english
DOI:
10.1109/IPFA.2018.8452605
File:
PDF, 9.89 MB
english, 2018