Thermal resistance modelling and design optimization of PCB vias
Shen, Yanfeng, Wang, Huai, Blaabjerg, FredeVolume:
88-90
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.07.028
Date:
September, 2018
File:
PDF, 2.94 MB
english, 2018