![](/img/cover-not-exists.png)
Fabrication and characterization of a low parasitic capacitance and low-stress Si interposer for 2.5D integration
Luo, Rong Feng, Wang, Shi Tao, Xia, Yan Ming, Ma, Sheng Lin, Wang, Wei, Chen, Jing, Jin, Yu FengYear:
2018
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2018.2871146
File:
PDF, 908 KB
english, 2018