A new application of SAM in the non-destructive inspection for SIM card
Cai, Bin, He, Yandong, Zhao, Yang, Chen, Yanning, Zhang, Haifeng, Zhao, DongyanVolume:
220
Language:
english
Journal:
IOP Conference Series: Materials Science and Engineering
DOI:
10.1088/1757-899X/220/1/012022
Date:
July, 2017
File:
PDF, 940 KB
english, 2017