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Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu 3 Sn proportion and joints with conventional interfacial structure in electronic packaging
Yao, Peng, Li, Xiaoyan, Han, Xu, Xu, LiufengLanguage:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/SSMT-06-2018-0018
Date:
October, 2018
File:
PDF, 676 KB
english, 2018