The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy
Ong, Chun Yee Aaron, Blackwood, Daniel John, Li, YiLanguage:
english
Journal:
Surface and Coatings Technology
DOI:
10.1016/j.surfcoat.2018.09.086
Date:
October, 2018
File:
PDF, 639 KB
english, 2018