Effects of Dummy Thermal Vias on Interconnect Delay and...

Effects of Dummy Thermal Vias on Interconnect Delay and Power Dissipation of Very Large Scale Integration Circuits

Xu, Peng, Pan, Zhongliang
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Volume:
23
Language:
english
Journal:
Wuhan University Journal of Natural Sciences
DOI:
10.1007/s11859-018-1345-7
Date:
October, 2018
File:
PDF, 1.12 MB
english, 2018
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