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Journal of Packaging Technology and Research 2018 / 8

PLA/EVA/Teak Wood Flour Biocomposites for Packaging Application: Evaluation of Mechanical Performance and Biodegradation Properties

Mullapudi, S. S., Pandey, K., Maiti, S. N., Saha, Sampa
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Language:
english
Journal:
Journal of Packaging Technology and Research
DOI:
10.1007/s41783-018-0037-2
Date:
August, 2018
File:
PDF, 1.53 MB
english, 2018
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