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Ultrasonic-Assisted Soldering of Low-Ag SAC Lead-Free Solder Paste at Low-Temperature
Gan, Gui-Sheng, Gan, Lin-Qiao, Guo, Ji-Zhao, Xia, Da-Quan, Zhang, Chunhong, Yang, Donghua, Wu, Yiping, Liu, CongVolume:
59
Year:
2018
Language:
english
Journal:
MATERIALS TRANSACTIONS
DOI:
10.2320/matertrans.M2017255
File:
PDF, 5.12 MB
english, 2018