Heat transfer improvement in microchannel heat sink by...

International Journal of Heat and Mass Transfer 2019 / 02 Vol. 129

Heat transfer improvement in microchannel heat sink by topology design and optimization for high heat flux chip cooling

Tan, Hui, Wu, Longwen, Wang, Mingyang, Yang, Zihao, Du, Pingan
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Volume:
129
Language:
english
Journal:
International Journal of Heat and Mass Transfer
DOI:
10.1016/j.ijheatmasstransfer.2018.09.092
Date:
February, 2019
File:
PDF, 4.09 MB
english, 2019
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