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Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability
Balmont, M., Bord Majek, I., Poupard, B., Bechou, L., Ousten, Y.Volume:
88-90
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.06.077
Date:
September, 2018
File:
PDF, 1.18 MB
english, 2018