Lock-in thermography for defect localization and thermal characterization for space application
Mousnier, M., Sanchez, K., Locatelli, E., Lebey, T., Bley, V.Volume:
88-90
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.07.014
Date:
September, 2018
File:
PDF, 3.90 MB
english, 2018