Through-Glass Vias for Glass Interposers and MEMS Packaging...

IEEE Access 2018 Vol. 6

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Laakso, Miku J., Bleiker, Simon J., Liljeholm, Jessica, Martensson, Gustaf E., Asiatici, Mikhail, Fischer, Andreas C., Stemme, Goran, Ebefors, Thorbjorn, Niklaus, Frank
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Volume:
6
Year:
2018
Language:
english
Journal:
IEEE Access
DOI:
10.1109/ACCESS.2018.2861886
File:
PDF, 2.57 MB
english, 2018
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