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PressureSensitiveandBondingAdhesivesforPackagingStackedIntegratedCircuits:D.EffectsofUVCuringoftheMulti-functionalAcrylateComponentontheBondingStrengthtoCopperPlate
EBE, Kazuyoshi, SENO, Hideo, SUGINO, Takashi, YAMAZAKI, OsamuVolume:
41
Year:
2005
Journal:
Journal of The Adhesion Society of Japan
DOI:
10.11618/adhesion.41.128
File:
PDF, 2.26 MB
2005