[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Design and Fabrication of the Silicon-based Integrated MIM Capacitors
Zhang, Rongzhen, Zhang, Qing, Zhou, Xiufeng, Zhu, Yetao, Ming, Xuefei, Gao, NayanYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480590
File:
PDF, 4.09 MB
english, 2018