Electroless Nickel Plating on Copper Fine Patterns by...

The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits 1997 Vol. 12; Iss. 1

Electroless Nickel Plating on Copper Fine Patterns by Selective Activation Process.

WATANABE, Hideto, IGARASHI, Yasushi, HONMA, Hideo
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Volume:
12
Year:
1997
Journal:
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
DOI:
10.5104/jiep1995.12.29
File:
PDF, 7.40 MB
1997
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