![](/img/cover-not-exists.png)
[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Sidewall Protection for a Wafer Level Chip Scale Package
Sun, Peng, Xu, Chen, Liu, Jun, Li, Zhaoqiang, Cao, LiqiangYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480608
File:
PDF, 4.41 MB
english, 2018