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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Electrical-Thermal Co-Simulation for LFBGA
Haiyan, SUN, Bo, GAO, Ling, SUN, Jicong, ZHAO, Yihong, PENG, Jiaen, FANG, Xiaoyong, MIAO, Honghui, WANGYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480709
File:
PDF, 4.23 MB
english, 2018