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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation
Fan, Jiajie, Hu, Aihua, Pecht, Michael, Chen, Wei, Fan, Xuejun, Xu, Dan, Zhang, GuoqiYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480748
File:
PDF, 3.85 MB
english, 2018