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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Thermal Simulation into the Effect of Varying Encapsulant Media on Wire Bond Stress Under Temperature Cycling
Packwood, Matt, Li, Daohui, Mumby-Croft, Paul, Dai, XiaopingYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480816
File:
PDF, 4.33 MB
english, 2018