[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Thermal Networks Generation and Application in IGBT Module Packaging
Li, Daohui, Li, Xiang, Qi, Fang, Packwood, Matthew, Luo, Haihui, Liu, Guoyou, Wang, Yangang, Dai, XiaopingYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480487
File:
PDF, 4.01 MB
english, 2018