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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Three-dimensional simulation of the effects of Cu protrusion of Cu-filled TSVs on thermal fatigue behavior of micro-bump joints in 3D integration
Zhou, Jie-Ying, Wei, Cheng, Liang, Shui-Bao, Jiang, Han, Ma, Xiao, Zhang, Xin-PingYear:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480623
File:
PDF, 8.62 MB
english, 2018