[IEEE 2018 19th International Conference on Electronic...

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[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - An online-sintering approach for bonding high-power devices using nanosilver paste

Yan, Haidong, Ma, Weiyong, Mei, Yunhui, Yang, Daoguo
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Year:
2018
Language:
english
DOI:
10.1109/ICEPT.2018.8480732
File:
PDF, 7.66 MB
english, 2018
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